APC 9FAC101 Saugnapf

Aluminum Backing<br>The back of the core panel is covered to further improve mechanical characteristics and increase thermal hygrometric stability.<br><br>Plastic Laminate Finish<br>The top of the core panel is covered in high pressure plastic laminate for added aesthetic value.<br><br>TR Pedestal Structure<br>Made from galvanized steel supports, these structures are available in different heights from 30 cm up to 150 cm and beyond. Together, they make a 60x60 cm support grid for the panels and they increase the mechanical resistance and stability of the floor. The support heads and steel frames are designed to be fastened to each other anywhere along the perimeter to enable support at higher distances and to have more freedom in installing any data center system in the under floor plenum.<br><br>High Density Wooden Chipboard Core<br>The best combination of mechanical properties and contained weights for an economic purchase and ease of installation.