Asrock Z590 OC Formula Intel Z590 LGA 1200 (Socket H5) Erweitertes ATX

Hersteller: ASROCK
Intel Z590, LGA1200, 2x DDR4, 2.5G LAN, Wi-Fi, Bluetooth, 3x PCI Express x16, 2x PCI Express 2.0 x1, SATA III, M.2, PS/2, S/PDIF, USB, EATX, 305x267 mm
Artikelnummer: CB72459
Herstellernummer: 90-MXBFS0-A0UAYZ
Verfügbarkeit: Auf Lager
€572,36 inkl. Steuer
exklusive Versand
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FOR PROFESSIONAL USE<br>Unlike most so called overclocking motherboards that are designed by engineers who don’t have adequate experience in extreme overclocking or have never participated in an OC event, Z590 OC Formula is the only motherboard in the market that are designed by a genuine overclocker, Nick Shih, who is hands down one of the most talented overclockers alive.<br><br>16 POWER PHASE DESIGN with 90A SPS<br>SPS (SMART POWER STAGE) is a new power solution with fully optimized integrated MOSFETs with advanced driver IC, current sensors and temperature sensors, which provides current monitoring and more stable current for extreme overclocking!<br><br>SMD TYPE DIMM<br>Compares to conventional DIP style DIMM slot, SMD type DIMM slot can reduce signal loss, improves stability under high frequency and maximize overclocking potential.<br><br>12 LAYERS SERVER-GRADE LOW-LOSS PCB<br>The 12 layers server grade PCB prevents PCB bending and improves signal integrity, giving higher performance as well as system stability, giving a reliable and long-lasting system without any compromise.<br><br>OC BUTTON<br>An array of OC friendly buttons with varies of function to help overclockers achieve the world record!<br><br>OLED DISPLAY<br>An OLED display was added to give a cleaner and informative way to express the status of the motherboard, the content can also be con gured in the BIOS for more user friendly application.<br><br>PCB Backdrill<br>Z590 OC Formula features a unique “PCB Backdrill” craftsmanship by removing the excess stub in multilayered printed wiring boards, this benefits in extreme memory overclocking by allowing signal to flow from layer to another with less signal attenuation and improves impedance matching.